Surface Mount Device Package Types

Bump chip carrier bga.

Surface mount device package types.

Ceramic ball grid array cfp. Surface mount device package types soic package. Ceramic pin grid array cpga graphic cqfp. Bumpered quad flat pack cabga ssbga.

A surface mount package is favored where a low profile package is required or the space available to mount the package is limited. Sot 223 small outline transistor. The small outline integrated circuit soic plastic package is shown above. Surface mount device package types.

Micro surface mount device extended technology. A very large number of different types of package exist. A dip can either be a surface mount or through hole device and refers to the location of the leads on either side of the devices case. There is a wide range of smd component packages available on the market and come in many shapes and sizes a selection can be seen below.

It is larger than the sot 23 and it measures 6 7 mm x 3 7 mm x 1 8 mm. As electronic devices become more complex and available space is reduced the desirability of a surface mount package increases. Example chip on board is a packaging technique that directly connects a die to a pcb without an interposer or lead frame. Ceramic land grid array see lga cpga.

Ceramic flat pack clga. Surface mount device or smd is the term used for the electronic components used within the surface mount assembly process.